Ceramic PEEK instruction manual
Ceramic PEEK instruction manual
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Ceramic PEEK instruction manual
Jun 12, 2019
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Ceramic peek has good performance and is widely used. In order for this sheet to better meet the needs of the industry, it is necessary to increase its performance. So what should I do? Practice shows that if the coupling treatment of molybdenum disulfide, graphite, ultra-fine carbon black, ultra-fine glass microbeads, carbon fiber, polytetrafluoroethylene, etc. can be added at the time of production, the friction coefficient can be lowered to improve the wear resistance; Then add rubber, polyurethane and so on to increase the coefficient of friction. After plasma cross-linking treatment, the UHMWPE can be used up to 200 ° C; the UHMWPE is filled with the coupled inorganic filler (such as glass beads, wollastonite, talcum powder. How to rise ultra-high molecular polyethylene) The various properties of the board of ultra-high molecular weight polyethylene sheet belong to a kind of engineering plastic sheet mica, calcium carbonate, etc.) can significantly increase the heat distortion temperature HDT. Adding metal powder such as copper powder, aluminum powder and lead powder can increase the thermal conductivity of UHMWPE. For the information on ultra-high molecular weight polyethylene sheets, the ultra-high molecular polyethylene itself has outstanding high temperature resistance characteristics, and then it can maintain normal operation under a certain high temperature environment.
  • And, when compared to ceramics, it is half the weight and provides greater impact resistance and toughness. It also has excellent processability and wear properties. Other advantages include insulation for good dielectric properties, excellent machining of tight pitches and fine-diameter holes for the production of integrated circuit test sockets, excellent machinability, low burrs, and fine test bench processing, Pin The foot can be 0.25mm, and the Pin spacing can be 0.3mm. It is the first choice for mobile phone test stand and high frequency IC chip test stand.

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